Esp32-S3 Core Board Development Board N8r2/N8r8/N16r8 Compatible with Devkitc-1

• Type: Combining Rigid Circuit Board
• Dielectric: SIC
• Material: Aluminum Covered Copper Foil Layer
• Model NO.: ESP32-S3
• Application: Medical Instruments
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Metal Composite Materials
• Item: Core Development Board
• Model: Esp32-S3
• Chip: CH340K/CH343p
• Format: N8r2/N8r8/N16r8
• Transport Package: Bag
• Specification: 57*28mm
• Trademark: ESPRESSIF
• Origin: Cn
• Production Capacity: 1000PCS/Month

Product Description

ESP32-S3 Core Board Compatible with DevKitC-1

 

ESP32-S3 Core Board

ESP32-S3N8R2
ESP32-S3N8R8
ESP32-S3N16R8

This series is backward compatible in sequence. Module programs with small storage specifications can run directly on storage modules with higher specifications without modification. For example, N4 programs can run on N8 and N16, and module programs with an external prom of 0 can run on external 2MB and 8MB psram modules.

Specification:

ESP32-S3 is an MCU chip that integrates 2.4GHz WiFi and Bluetooth 5 (LE), supporting long range mode (Long Range). ESP32-S3 is equipped with Xtensa 32-bit LX7 dual-core processor, with a main frequency of up to 240MHz, built-in 512KB SRAM (TCM), 45 programmable GPIO pins and rich communication interfaces. ESP32-S3 supports larger capacity high-speed OctalSPIflash and off-chip RAM, and supports user-configured data cache and instruction cache.
 
SIZE:

Product Features:
 

WiFi

Bluetooth

1.Support IEEE80.2 11b/g/n protocol 2.Support 20MHz and 40MHz bandwidth in 2.4GHz band 3.Support 1H R mode, data rate up to 150Mbps 4.Wireless Multimedia (WMM) 5.Frame aggregation (TX/RX A-MPDU, TX/RX A-MSDU) 6.Immediate Block ACK 7.Fragmentation and defragmentation 8.Transmit Opportunity (TXOP) 9.Beacon automatic monitoring (hardware TSF) 10.4x virtual Wi-Fi interface 11.Support infrastructure BSS Station mode, SoftAP mode, Station+SoftAP mode and mixed mode 12.Antenna diversity 13.802.11 mc FTM 14.Support external power amplifier

1. Bluetooth LE: Bluetooth 5, Bluetooth mesh 2. High power mode (20dBm) shares PA with Wifi 3. Rates support 125Kbps, 500Kbps, 1Mbps, 2Mbps 4. Advertising Extensions 5. Multiple Advertisement Sets 6. Channel Selection Algorithm #2 7. Wi-Fi and Bluetooth coexist, sharing the same antenna

 

CPU&Storage	Advanced peripheral interfaces and sensors
1.32-bit LX7 dual-core processor, main frequency up to 240MHz 2.CoreMark: 2.1 Single core main frequency 240MHz: 613.86CoreMark; 2.56CoreMark/MHz 2.2 Dual core main frequency 240MHz: 1181.60CoreMark; 4.92CoreMark/MHz 3. 128-bit data bus width, support SIMD instructions 4. 384KB ROM 5. 512KB SRAM 6. 16KB RTC SRAM 7.SPI, Dual SPI, Quad SPI, Octal SPI, QPI, OPI, QPI interface external multiple flash and off-chip RAM 8. Introduce cache mechanism flash controller 9. Support flash online programming	1. 45x GPIO ports 2. Digital interfaces: -4x SPI -1x LCD interface (8-bit ~ 16-bit parallel RGB, I8080,MOTO6800) supports conversion between RGB565, YUV422, YUV420, YUV411 -1x DVP 8-bit to 16-bit camera interface -3x UART -2x I2C -2x I2S -1x RMT (TX/RX) -1x pulse counter -LED RWM controller up to 8 channels -1x full-speed USB OTG -1x USB Serial/JTAG controller -2x MCPWM -1x SDIO host interface with 2 card slots -General DMA controller (GDMA for short), 5 receiving channels and 5 transmitting channels -1x TWAI controller, compatible with ISO11898-1 (CAN specification 2.0) 3. Analog interfaces: -2x 12-bit SAR DAC, up to 20 channels -1x temperature sensor 4. Timers: -4x 54-bit general purpose timers -1x 52-bit system timer -3x watchdog timers
Safety Mechanism	Low power management
1. Secure boot 2. Flash encryption 3. 4096-bit OTP, up to 1652 bits available to users 4. Cryptographic hardware accelerator: -AES-128/256 (FIPS PUB 197) 5. Hash (FIPS PUB 180-4) 6. RSA 7. Random number generator (RNG) 8. HMAC 9. Digital signature	Power management unit, five power modes Ultra-low power processor (ULP): -ULP-RISC-V coprocessor -ULP-FSM coprocessor

Pin Definition:

Packing&Shipping

1. pls Confirm your Address carefully once you make the order, if package returned or have some problems caused by your wrong information, you need bear the responsbility.
2. If your address out of shipping company's service, you willneed pay remote fees. we will contact you before we delivered the parcel.
3. Delivery time maybe uncontrolled during the holiday or badweather, if you have not received parcel over scheduled time, pls contact us promptly.