Metal Coating: | Copper |
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Mode of Production: | SMT |
Layers: | Multilayer |
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Category | Project | Product Specifications |
Wi-Fi | RF Certification | FCC/CE/RoHS |
Protocol | 802.11 b/g/n/e/i(802.11n,up to 150Mbps) A-MPDU and A-MSDU Aggregation,Support 0.4_s Guard Interval |
|
Frequency Range | 2.4~2.5GHz | |
Bluetooth | Protocol | Compliant with Bluetooth v4.2 BR/EDR and BLE Standards |
Radio Frequency | NZIF Receiver with -97dBm Sensitivity | |
Hardware | Network Port Specifications | RJ45,10/100Mbps,Crossover Direct Connection Adaptive |
Serial Port Baud Rate | 80~5000000 | |
Onboard Flash | 32Mbit | |
Operating Voltage | 5V or 3.3V Power Supply(Optional) | |
Working Current | Average: 80mA | |
Supply Current | Minimun: 500mA | |
Range of Working Temperature | -40ºC~+85ºC | |
Ambient Temperature Range | Normal Temperature | |
Connector Way | Half Pad/Connector through Hole Connection(Optional) | |
Software | Wi-Fi Mode | Station/SoftAP/SoftAP+Station/P2P |
Wi-Fi Security Mechanisms | WPA/WPA2/WPA2-Enterprise/WPS | |
Encryption Type | AES/RSA/ECC/SHA | |
Firmware Upgrade | Remote OTA Upgrade Via Network | |
Software Development | SDK is used for Secondary Development of Users | |
Network Protocol | IPv4,TCP/UDP | |
How to Get IP | Static IP,DHCP(Default) | |
Simple Transparent Transmission | TCP Server/TCP Client/UDP Server/UDP Client | |
User Configuration | AT+Instruction Set |
Adopts dual-core Xtensa@ 32-bit LX6 MCU. Integrated SPI Flash 32Mbitl/SRAM 52OKB supports TCP Server, TCP Client, UDP Server, and UDP ClientT m ode.
Supports serial port, wifi, Ethernet, and Bluetooth data ports in pairs. Transparent data transmission Supports firmupgradesgrade by connecting to the network over a wired network or wifi.
Supports wifi to connect to the Internet or LAN through a restablishestablish a TCP/UDP conaccessesn, access the user's designatsupportser, support wired network supports and support user secondary development.